The 25th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. EPTC2023 will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.
The EPTC technical program committee, with more than 100 experts from diverse semiconductor packaging technology areas, is committed to creating an engaging technical program for the international packaging community. The technical program will be supplemented by an exhibition, which provides an opportunity for leading companies to exhibit their latest technologies and products. Last year there were 430 attendees. This year being our 25th Anniversary, we have a special 4-day program and expect more attendees.
CONFERENCE TOPICS
Research publication covered from the below major conference topics
Advanced Packaging
TSV/Wafer Level Packaging
Interconnection Technologies
Emerging Technologies
Materials and Processing:
Assembly and Manufacturing Technology
Advanced Materials and Process Manufacturing Technology
Electrical Simulation & Characterization
Mechanical Simulation & Characterization
Thermal Characterization & Management
Quality, Reliability & Failure Analysis
Advanced Optoelectronics and Displays
Smart Manufacturing and Packaging Equipment Technology